Statistics on the production of manufactured goods prom. Prodcom contains Prodcom statistics on production of manufactured goods together with related external trade data. The data characteristics described in this documentation refer to the Prodcom production data. For external trade data characteristics, please see documentation for Comext. The Geonomenclature is used to identify reporting countries.
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- Electronics industry
- How Should You Organize Manufacturing?
- Electronics manufacturing services
- Electronic & General Purpose Cleaning
- Electronic Components & Devices
- Computer and Electronic Product Manufacturing Industries
- Reuse of Components and Products: “Qualified as Good as New”
- Computer and Electronic Product Manufacturing: NAICS 334
- Electronic packaging
- Ultimate Guide – How to Develop a New Electronic Hardware Product in 2019
Electronics industryVIDEO ON THE TOPIC: Designing and manufacturing electronic products with BitBox
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts.
Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal.
Electronic packaging is a major discipline within the field of mechanical engineering. The same electronic system may be packaged as a portable device or adapted for fixed mounting in an instrument rack or permanent installation. Packaging for aerospace, marine, or military systems imposes different types of design criteria.
Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid mechanics. High-reliability equipment often must survive drop tests, loose cargo vibration, secured cargo vibration, extreme temperatures, humidity, water immersion or spray, rain, sunlight UV, IR and visible light , salt spray, explosive shock, and many more.
These requirements extend beyond and interact with the electrical design. An electronics assembly consists of component devices, circuit card assemblies CCAs , connectors, cables and components such as transformers, power supplies, relays, switches, etc.
Many electrical products require the manufacturing of high-volume, low-cost parts such as enclosures or covers by techniques such as injection molding, die casting, investment casting, and so on. The design of these products depends on the production method and require careful consideration of dimensions and tolerances and tooling design.
Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures. In the design of electronic products, electronic packaging engineers perform analyses to estimate such things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments.
Such knowledge is important to prevent immediate or premature electronic product failures. A designer must balance many objectives and practical considerations when selecting packaging methods.
Punched and formed sheet metal is one of the oldest types of electronic packaging. It can be mechanically strong, provides electromagnetic shielding when the product requires that feature, and is easily made for prototypes and small production runs with little custom tooling expense.
Gasketed metal castings are sometimes used to package electronic equipment for exceptionally severe environments, such as in heavy industry, aboard ship, or deep under water. Aluminum die castings are more common than iron or steel sand castings.
Electronic packages are sometimes made by machining solid blocks of metal, usually aluminum, into complex shapes. They are fairly common in microwave assemblies for aerospace use, where precision transmission lines require complex metal shapes, in combination with hermetically sealed housings. Quantities tend to be small; sometimes only one unit of a custom design is required.
Piece part costs are high, but there is little or no cost for custom tooling, and first-piece deliveries can take as little as half a day. The tool of choice is a numerically controlled vertical milling machine, with automatic translation of computer-aided design CAD files to toolpath command files.
Molded plastic cases and structural parts can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly.
Examples are injection molding, transfer molding, vacuum forming, and die cutting. Pl can be post-processed to provide conductive surfaces. Formally called "encapsulation", potting consists of immersing the part or assembly in a liquid resin, then curing it. Potting can be done in a pre-molded potting shell, or directly in a mold. Today it is most widely used to protect semiconductor components from moisture and mechanical damage, and to serve as a mechanical structure holding the lead frame and the chip together.
In earlier times it was often used to discourage reverse engineering of proprietary products built as printed circuit modules.
It is also commonly used in high voltage products to allow live parts to be placed closer together, so that the product can be smaller. This also excludes dirt and conductive contaminants such as impure water from sensitive areas. Another use is to protect deep-submergence items such as sonar transducers from collapsing under extreme pressure, by filling all voids. Potting can be rigid or soft.
When void-free potting is required, it is common practice to place the product in a vacuum chamber while the resin is still liquid, hold a vacuum for several minutes to draw the air out of internal cavities and the resin itself, then release the vacuum. Atmospheric pressure collapses the voids and forces the liquid resin into all internal spaces. Vacuum potting works best with resins that cure by polymerization, rather than solvent evaporation. Porosity Sealing or Resin Impregnation is similar to potting, but doesn't use a shell or a mold.
Parts are submerged in a polymerizable monomer or solvent-based low viscosity plastic solution. The pressure above the fluid is lowered to a full vacuum. After the vacuum is released, the fluid flows into the part.
Curing can consist of polymerizing the internal resin or evaporating the solvent, which leaves an insulating dielectric material between different voltage components. The main application of vacuum impregnation porosity sealing is in boosting the dielectric strength of transformers, solenoids, lamination stacks or coils, and some high voltage components. It prevents ionization from forming between closely spaced live surfaces and initiating failure.
Liquid filling is sometimes used as an alternative to potting or impregnation. It's usually a dielectric fluid, chosen for chemical compatibility with the other materials present. This method is used mostly in very large electrical equipment such as utility transformers, to increase breakdown voltage.
It can also be used to improve heat transfer, especially if allowed to circulate by natural convection or forced convection through a heat exchanger. Liquid filling can be removed for repair much more easily than potting. Conformal coating is a thin insulating coating applied by various methods. It provides mechanical and chemical protection of delicate components.
It's widely used on mass-produced items such as axial-lead resistors, and sometimes on printed circuit boards. It can be very economical, but somewhat difficult to achieve consistent process quality.
Glop-top is a variant of conformal coating used in chip-on-board assembly COB. It consists of a drop of specially formulated epoxy  or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation.
It is most commonly used in electronic toys and low-end devices. In these, the individual diodes are mounted in an array that allows the device to produce a greater amount of luminous flux with greater ability to dissipate the resulting heat in an overall smaller package than can be accomplished by mounting LEDs, even surface mount types, individually on a circuit board.
Hermetic metal packaging began life in the vacuum tube industry, where a totally leak-proof housing was essential to operation. This industry developed the glass-seal electrical feedthrough, using alloys such as Kovar to match the coefficient of expansion of the sealing glass so as to minimize mechanical stress on the critical metal-glass bond as the tube warmed up.
Some later tubes used metal cases and feedthroughs, and only the insulation around the individual feedthroughs used glass. Today, glass-seal packages are used mostly in critical components and assemblies for aerospace use, where leakage must be prevented even under extreme changes in temperature, pressure, and humidity.
Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate. Printed circuits are primarily a technology for connecting components together, but they also provide mechanical structure. In some products, such as computer accessory boards, they're all the structure there is.
This makes them part of the universe of electronic packaging. Hygrothermal test is performed in chambers with temperature and humidity. It is an environmental stress test used in evaluating product reliability. During the test, the sample is periodically taken out to test its mechanical or electrical properties.
Some research works related to hygrothermal test can be seen in the references. From Wikipedia, the free encyclopedia. This article needs additional citations for verification.
Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. Main article: Potting electronics. Further information: Conformal coating and Parylene. Design World. Elsevier Science. Wu et al. Microelectronics Reliability.
Semiconductor packages. Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology. Note: It's relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.
Among the characteristics of a company that shape corporate and therefore manufacturing strategy are its dominant orientation market or product , pattern of diversification product, market, or process , attitude toward growth acceptance of low growth rate , and choice between competitive strategies high profit margins versus high output volumes. Once the basic attitudes or priorities are established, […]. Once the basic attitudes or priorities are established, the manufacturing arm of a company must arrange its structure and management so as to reinforce these corporate aims. When they are operating smoothly, they are almost invisible. But manufacturing is getting increasing attention from business managers who, only a few years ago, were preoccupied with marketing or financial matters. The fact is that in most companies the great bulk of the assets used—the capital invested, the people employed, and management time—are in the operations side of the business.
How Should You Organize Manufacturing?
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Electronics manufacturing services
We specialize in high-mix, flexible-volume precision manufacturing, as well as designing custom RFID solutions tags, readers, and software. We have a combined total of , sq ft for our two facilities in Chennai. All of our facilities can easily handle global exports and are close to major air and sea ports. These advantages uniquely position us to quickly deliver exceptional quality products at significant cost savings for every Syrma client. Since we manufacture in India with minimal reliance on costly additional imports, we offer distinct advantages in lead time, quality, and production flexibility within cost-conscious objectives of our clients. These SEZs and IT parks are designed to offer our own facilities , along with infrastructure provided by our partners to ensure time to market.SEE VIDEO BY TOPIC: Electronic manufacturing products and services for original equipment manufacture
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Electronic & General Purpose Cleaning
The electronics industry emerged in the 20th century and is today one of the largest global industries. Contemporary society uses a vast array of electronic devices built in automated or semi-automated factories operated by the industry. Products are primarily assembled from metal-oxide-semiconductor MOS transistors and integrated circuits , the latter principally by photolithography and often on printed circuit boards. The size of the industry and the use of toxic materials, as well as the difficulty of recycling has led to a series of problems with electronic waste.
The computer and electronic product manufacturing industry produces computers, computer peripherals, communications equipment, and similar electronic products. These products are used in homes and businesses, as well as in government and military establishments. Goods and services. This industry differs somewhat from other manufacturing industries in that production workers make up a relatively small proportion of the workforce. Technological innovation characterizes this industry more than most others and, in fact, drives much of the industry's production. Likewise, the importance of promoting and selling the products manufactured by the various segments of the industry requires knowledgeable marketing and sales workers. American companies in this industry manufacture and assemble many products abroad to take advantage of lower production costs and favorable regulatory environments. Most electronic products contain many intermediate components that are purchased from other manufacturers. Companies producing intermediate components and finished goods often choose to locate near each other so that companies can receive new products more quickly and lower their inventory costs.
Electronic Components & Devices
Saab has the expertise, experience and resources to work with EMC issues from the drawing board and advice to the verification of finished products. We offer tests on everything from electronic components, antennas and entire electronic systems for passenger cars, trucks, combat vehicles and aircraft. We also hold appreciated training courses within the EMC field, which helps the customer to understand what EMC is and how they design electronics systems from an EMC perspective. Regardless of the product, its electronic systems must work together in the environment in which they are intended to be used. The systems should also not be disturbed by systems in other products or in turn interfere with them.
Computer and Electronic Product Manufacturing Industries
We will actively pursue the further development of quartz crystal products to support the continued growth of our networked society. Capacitors Capacitors are essential to virtually all forms of electronic equipment, from smartphones and wearable devices to industrial machines. Kyocera contributes to the advancement of electronics through cutting-edge technology and high quality throughout the manufacturing process. Kyocera's wide range of SAW devices includes filters and duplexers. Crystal Units. Kyocera has a wide variety of ultra miniature, high accuracy and wide temperature range operating crystal units. The K-series utilizes a common platform design covering case sizes through High frequency options and a variety of output types support customer needs.
Reuse of Components and Products: “Qualified as Good as New”
Handbook of Sustainable Engineering pp Cite as. This standard has been initiated by the authors of this chapter, who have worked out the quagan concept to overcome prejudices against and to promote reuse of components and products.
Computer and Electronic Product Manufacturing: NAICS 334
The concept is also referred to as electronics contract manufacturing ECM. Many consumer electronics are built in China, due to maintenance cost, availability of materials, quality, and speed as opposed to other countries such as the United States. The EMS industry took off after the late s when Solectron was established.
Take me to the Knowledge Base. Product Details. Contact Cleaner C is a non-flammable fast-drying solvent specially formulated for the quick and efficient cleaning of electrical equipment. Non-flammable safety solvent for use on live equipment.
Ultimate Guide – How to Develop a New Electronic Hardware Product in 2019
An official website of the United States government Here is how you know. Federal government websites often end in.